Description 3D Solder Paste Inspection Measurement System LOW-COST 3D SPI System Low-Cost, Off-Line, 3D SPI system supports multiple SMT lines for inspecting solder paste printing Improve your product yield and meet your customer’s requirements with an affordable budget Same measuring technique as high-end automated in-line SPI system Measure solder paste height with a laser beam 3D real-time view of solder paste Zoom 15x – 200x Can Also Measure Typical Dimensions like Linear, XY, Radius, Diameter, Angle, Area, etc. Multiple Applications You can inspect and measure BGA solder joints and fine-pitch SMT with this SPI-200-3D system Laser Light Triangulation Method To Measure Solder Paste Height and Any Height or Depth Measurements Fast, Easy, No Programming Easy to use, NO training required, Ready to Implement Simple mouse clicks to get results FAST A economic, off-line, bench-yop unit supports multiple SMT lines Save measurements with image, and export measurement results to Excel Perform measurements with a mouse and show results directly on LCD, without a computer. Or, connect to a Windows computer and perform measurements on a PC. 3D rotational viewing lens included for Solder Inspection 3D BGA Inspection Soldering Rework Specifications SPI-200-3D Specifications Camera Auto Focus 6MP CMOS HD and USB dual outputs digital microscope camera Illumination High-intensity white LED ring light with intensity adjustment Measurement mode Multiple or single points height measuring within the Field Of View Measuring Laser Precise red laser line with intensity adjustment for paste height profiling Z height resolution 1 micron Repeatability ± 2 microns Measurement Software Measure solder paste height with laser line offset. Measurement function: XY, radius, diameter, angle, area, width, and path length. Multiple calibrations, annotation, crosshairs, reticles, and comparison. Image Stacking for Infinite Depth of Focus Photo sticking for extender field of view at high resolution. Measurement data output to Excel. Save image as jpg with measurement results. Measurement Accuracy (XY) 5μ at 30x 1μ at 200x 3D inspection mode 3D 360° manual rotation with 35° oblique angle viewing and 0° straight down view Zoom Lens 30x-200x zoom with detents Expandable with optional lens adapters: 0.3x, 0.5x, 0.7x, 1.5x, 2x. Field of View 1.2mm (at 200x) to 8mm (at 30x) Viewing angle 0° straight view and 30° angle view with standard system Working Distance 100mm (4″) WD with a straight view 50mm (2″) WD with 30° angle view adapter System Stand Multi-position arm boom stand with focus control block and weight base Power Supply 120-240V AC 50/60Hz Computer Requirements Windows 10/8/7 with USB2.0 port Warranty One Year Warranty Options LCD-12 12″ UltraSharp Retina Display 1920x1080p real-time 60 FPS viewing, HDMI Input Mounted on HD-60 camera for direct line of sight ergonomic inspection LCD-24 24” Desktop 1920x1080p real-time 60 FPS viewing, HDMI Input BGA-HM BGA inspection mirror to work with SPI-200 for inspecting BGA solder joints XY1711 17″ x 11″ XY sliding stage for Multi-position boom stand
